欧司朗光电半导体(中国)有限公司
(Sr.) Die Bond Engineer12万 - 22万 无锡 | 3年以上 | 本科及以上 | 全职
职位福利:年终奖金,五险一金,福利好,老板nice,年底双薪,年度旅游,成长空间大,交通补助,节日礼物,技能培训,免费班车
发布时间:2020-07-28 发布者:June Huang 投递简历
描述:
Job Responsible:
1. Identify problems or unfavorable process deviations and execute/implement corrective/improvement actions
2. Take the lead on customer complaint investigation and 8D responsibilities
3. Daily monitoring and dispose on abnormal/maverick lots, low yield lots.
4. To training and compile process documentation filling and update, WI, FMEA…
5. Provide sustaining engineering support to the manufacturing team through detailed failure analysis, technical support, documentation revisions, assembly support, and training support to resolve issues in a timely fashion
6. Work on continue improvement project to simplify/improve the flow/system which can reduce the system loop
holes or ease the daily task
Job Requiremnet:
1. At least 3-4 years experience on semiconductor assembly area, main focus on Die Attach process and bachelor in EE
2. Need to be able to accept changes from time to time . Must be stress tolerance as we are directly dealing with production
3. Good communication skills and team work spirit. Good English read and writing skills, oral English is also preferred
4. Excellent Microsoft office application skill