Quantitatively understand stress related failure in MPS products and find optimization by FEA in trouble-shooting, and predict stress risks in product design phase 定量了解MPS产品的应力相关失效，并在故障诊断中利用有限元法进行优化，在产品设计阶段预测应力风险

Responsibilities岗位职责:
·     Mechanical or thermal stress analysis on package level & board level; 封装级和板级的机械或热应力分析
·     package & board level heat dissipation simulation ; 封装和板级散热模拟
·     Parametric analysis on ranking key impact factors for improved product reliability; 对提高产品可靠性的关键影响因素进行参数分析
·     provide improvement solution for IC packaging related fracture ,fatigue, warpage, interface delamination issues through FEA simulation at both early failure and long term failure stage ; 通过早期失效和长期失效阶段的FEA模拟，为IC封装相关的断裂、疲劳、翘曲、界面分层问题提供改进解决方案
·     classify stress related failure and accordingly the failure mechanisms; 对应力相关失效进行分类，并相应地对失效机制进行分类
·     optimize device & package structure or design to mitigate cracking related failure from  stress ,warpage ,material , and manufacturing perspective ;  优化设备和封装结构或设计，从应力、翘曲、材料和制造角度缓解开裂相关故障

Requirements岗位要求:
·     MS degree in Mechanical Engineering , Engineering Mechanics,  Materials, Physics , or solid training in mechanics ; 机械工程、工程力学、材料学、物理学硕士学位，或机械方面的扎实训练
·     Strong knowledge and experience on thermal-mechanical modeling, fatigue failure modeling, and heat dissipation simulation ; 在热机械建模、疲劳失效建模和散热模拟方面有丰富的知识和经验
·     Hands-on experience of major FEA tools (e.g.,ANSYS, ABAQUS,Hypermesh, ,etc),heat dissipation simulation tools(e.g., Icepak,Flotherm,etc. )  and modeling tools (e.g., Solidworks,ProE,etc); 主要有限元分析工具（如ANSYS、ABAQUS、Hypermesh等）、散热模拟工具（如Icepak、Flotherm等）和建模工具（如Solidworks、ProE等）的实践经验
·     Deep understanding of packaging materials (including soldering materials ) and their mechanical behaviors ; 深入了解包装材料（包括焊接材料）及其机械性能
·     Good at statistical data analysis ; 擅长统计数据分析
·     Knowledge of electronic packaging structure and process ,as well as its reliability;Package qualification requirements is a plus; 了解电子封装结构和工艺及其可靠性；有封装资格要求者优先
·     Good team player , and able to perform independent research & development work;Good written and verbal communication skills ; 良好的团队合作精神，能够独立完成研发工作；良好的书面和口头沟通能力