1.      New wafer service process & equipment development, which includes but not limited to: wafer BGBM, wafer plating, wafer bumping, wafer ball drop, wafer molding, implant & etc.
2.      Wafer service process control and continuous improvement.
3.      Drive the yield improvement and cost reduction activities.
4.      Qualify second source equipment / tooling / raw materials to ensure supplier change and competitive cost.  
5.      Drive the improvement of UPH and process efficiency.
6.      Wafer level package process development and control.
7.      Supporting package R&D activities.
8.      Equipment and tooling management to ensure the daily output with acceptable quality.
9.      Co-work with QRA team for trouble shooting and quality issue.
10.   Ensure inline lots with quality excursion are properly handled and disposed of.